发明名称 CROSS-POINT MEMORY STRUCTURES, AND METHODS OF FORMING MEMORY ARRAYS
摘要 <p>Some embodiments include cross-point memory structures. The structures may include a line of first electrode material extending along a first horizontal direction, a multi-sided container of access device materials over the first electrode material, a memory element material within the multi-sided container, and a line of second electrode material over the memory element material and extending along a second horizontal direction that is orthogonal to the first horizontal direction. Some embodiments include methods of forming memory arrays. The methods may include forming a memory cell stack over a first electrode material, and then patterning the first electrode material and the memory cell stack into a first set of spaced lines extending along a first horizontal direction. Spaced lines of second electrode material may be formed over the first set of spaced lines, and may extend along a second horizontal direction that is orthogonal to the first horizontal direction.</p>
申请公布号 EP2399287(A4) 申请公布日期 2013.07.10
申请号 EP20100744098 申请日期 2010.01.19
申请人 MICRON TECHNOLOGY, INC. 发明人 SILLS, SCOTT;SANDHU, GURTEJ, S.
分类号 H01L21/8239;H01L21/027;H01L27/10 主分类号 H01L21/8239
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