发明名称 MULTILAYER WIRING BOARD
摘要 <p>A multilayer wiring board 100 comprises a first wiring region 101 where wirings 103a and insulating layers 104a and 104b are alternately laminated, and a second wiring region 102 where a thickness H2 of an insulating layer 104 is twice or more a thickness H1 of the insulating layer in the first wiring region 101 and a width W2 of a wiring 103b is twice or more a width W1 of the wiring in the first wiring region 101. The first wiring region 101 and the second wiring region 102 are integrally formed on the same board.</p>
申请公布号 EP2284882(B1) 申请公布日期 2013.07.10
申请号 EP20090758223 申请日期 2009.05.22
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE 发明人 OHMI, TADAHIRO;SUGAWA, SHIGETOSHI;IMAI, HIROSHI;TERAMOTO, AKINOBU
分类号 H05K1/02;H01L23/12;H01L23/66;H01P3/08;H05K3/46 主分类号 H05K1/02
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