<p>A multilayer wiring board 100 comprises a first wiring region 101 where wirings 103a and insulating layers 104a and 104b are alternately laminated, and a second wiring region 102 where a thickness H2 of an insulating layer 104 is twice or more a thickness H1 of the insulating layer in the first wiring region 101 and a width W2 of a wiring 103b is twice or more a width W1 of the wiring in the first wiring region 101. The first wiring region 101 and the second wiring region 102 are integrally formed on the same board.</p>
申请公布号
EP2284882(B1)
申请公布日期
2013.07.10
申请号
EP20090758223
申请日期
2009.05.22
申请人
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE