SUBSTRATE HAVING THIN FILM OF JOINED AND METHOD OF FABRICATING THEREOF

摘要

PURPOSE: A thin film bonding substrate and a method for fabricating the same are provided to prevent cracks by forming a buffer layer between a crystalline thin film and a heterogeneous substrate. CONSTITUTION: A heterogeneous substrate (130) is bonded to a crystalline thin film (110). The chemical composition of the heterogeneous substrate is different from the chemical composition of the crystalline thin film. A buffer layer (120) is formed between the crystalline thin film and the heterogeneous substrate. The buffer layer is made of a transparent conductive material. The thickness of the buffer layer is 10 nm to 10 μm.