| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems wherein a light-emitting device may be deformed by warpage on the interface between a substrate and a light-transmitting member since the substrate and the light-transmitting member are thermally expanded by heat generated by a light-emitting element in the use of the light-emitting device and the coefficient of thermal expansion of the substrate differs from that of the light-transmitting member, and large stress may be applied by the warpage, especially closer to the substrate and the side edge of the light-transmitting member. <P>SOLUTION: The light-emitting device includes: the substrate including a main surface; a light-emitting element arranged on a main surface of the substrate; and the light-transmitting member positioned on the main surface of the substrate to cover the light-transmitting element. In this case, porosity becomes larger toward the edge from the center on the section of the light-transmitting member vertical to the main surface of the substrate in the light-transmitting member. <P>COPYRIGHT: (C)2010,JPO&INPIT |
