HAPTIC DEVICE MODULE

摘要

PURPOSE: A haptic device module is provided to improve the welding reliability of an upper and lower case by filling the gap between the upper and lower case with a silicon bond even if the gap is wide. CONSTITUTION: A lower case (120) comprises the protrusion welding units (121) along the longitudinal direction. An upper case (110) comprises the protrusions (111) which are bent to cover the lower case in both sides of the protrusion welding units. A vibration plate (130) includes a piezoelectric element in one side. The vibration plate contacts between the upper and lower case. The upper and lower case are welded by including the silicon bond in the upper case surface between the protrusion welding unit and the protrusions. The upper and lower case are welded by including the silicon bond in the overlapped part along the edge.