发明名称 SEALED AND PRESSURIZED LIQUID COOLING SYSTEM FOR MICROPROCESSOR
摘要 According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.
申请公布号 KR101285067(B1) 申请公布日期 2013.07.10
申请号 KR20087022305 申请日期 2003.12.08
申请人 发明人
分类号 G06F1/20;H01L23/34;H01L23/473;H05K7/20 主分类号 G06F1/20
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