| 摘要 |
PURPOSE: A method for manufacturing a molybdenum (Mo) alloy sputtering target material and the Mo alloy sputtering target material are provided to lower an electric resistance, to improve a thermal resistance, a moisture resistance, and an adhesive property to a substrate, and to obtain high density and high purity suitable for an electrode-wiring film. CONSTITUTION: A molybdenum (Mo) alloy sputtering target includes 10 to 49 atom% of Ni, 1 to 20 atom% of Nb, and remnants Mo and inevitable impurities. The total amount of Nb and Ni is below 50 atom%. A method for manufacturing the material includes: a step of forming a mixture of Mo powder and at least one or two kinds of Ni alloy powder; and a step of continuously pressurizing and sintering the mixture. The Ni alloy powder is formed with a Ni-Nb alloy.
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