发明名称 Method of producing a land grid array interposer
摘要 A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
申请公布号 US8479388(B2) 申请公布日期 2013.07.09
申请号 US20080207713 申请日期 2008.09.10
申请人 HOUGHAM GARETH G.;BEAMAN BRIAN S.;COLGAN EVAN G.;COTEUS PAUL W.;OGGIONI STEFANO S.;VARGAS ENRIQUE;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HOUGHAM GARETH G.;BEAMAN BRIAN S.;COLGAN EVAN G.;COTEUS PAUL W.;OGGIONI STEFANO S.;VARGAS ENRIQUE
分类号 H01K3/10 主分类号 H01K3/10
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