| 摘要 |
A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad. |
