| 摘要 |
Provided is a semiconductor device that may prevent a test pad planned not to be wire bonded from being wire bonded. The semiconductor device may include a bonding pad planned to be wire bonded and a test pad planned not to be wire bonded, and a passivation layer including a first opening portion exposing part of the bonding pad and a second opening portion exposing part of the test pad, wherein the diameter of the first opening portion is greater than the diameter of a tip of a bonding wire, and the diameter of the second opening portion is less than the diameter of the tip of the bonding wire.
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