| 摘要 |
<p>PURPOSE: A wiring substrate and a wiring substrate manufacturing method are provided to improve the accuracy of an insulating layer forming process and thus decreases the defective rate of the process. CONSTITUTION: A wiring substrate includes a base material (100), multiple conductive patterns (200) which are arranged on one side of the material; and a photo solder resist layer (300) which is formed on the partial region of the material and the conductive patterns includes a body and a plurality of protrusions which are formed on one side of the body.</p> |
