| 摘要 |
PURPOSE: A semiconductor package and fabricating method thereof are provided to reduce processing time by reducing the depth of a through electrode. CONSTITUTION: A first through electrode (120) passes through a substrate. A first semiconductor chip (160) is located in a recess region. The first semiconductor chip is electrically connected to the first through electrode. A redistribution pattern layer (140) is located on the second surface of the substrate. The redistribution pattern layer is electrically connected to redistribute the first through electrode.
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