发明名称 Phase change memory and method for fabricating the same
摘要 The invention provides a phase change memory and a method for forming the phase change memory. The phase change memory includes a storage region and a peripheral circuit region. The peripheral circuit region has a peripheral substrate, a plurality of peripheral shallow trench isolation (STI) units in the peripheral substrate, and at least one MOS transistor on the peripheral substrate and between the peripheral STI units. The storage region has a storage substrate, an N-type ion buried layer on the storage substrate, a plurality of vertical LEDs on the N-type ion buried layer, a plurality of storage shallow trench isolation (STI) units between the vertical LEDs, and a plurality of phase change layers on the vertical LED and between the storage STI units. The storage STI units have thickness substantially equal to thickness of the vertical LEDs. The peripheral STI units have thickness substantially equal to thickness of the storage STI units. The N-type conductive region contains SiC. A top of P-type conductive region is flush with a top of the peripheral substrate. The N-type conductive region containing SiC reduces drain current through the vertical LED and raises current efficiency of the vertical LED. The peripheral circuit region can work normally without adverse influence on performance of the phase change memory.
申请公布号 US8481348(B2) 申请公布日期 2013.07.09
申请号 US201113176632 申请日期 2011.07.05
申请人 MIENO FUMITAKE;HE YOUFENG;SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. 发明人 MIENO FUMITAKE;HE YOUFENG
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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