| 摘要 |
<p>PURPOSE: A semiconductor package and a method for manufacturing the same are provided to simplify processes by successively manufacturing passive devices in a package process after a process for forming a passivation layer is performed. CONSTITUTION: A semiconductor chip (120) is mounted on a package substrate. A passivation layer (140) molds the semiconductor chip on the package substrate. A via layer electrically connects a passive device (150) to the package substrate. The passive device is arranged on the passivation layer. The first electrode and the second electrode of the passive device are arranged on different surfaces of the passivation layer.</p> |
