发明名称 |
Pad bonding employing a self-aligned plated liner for adhesion enhancement |
摘要 |
Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.
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申请公布号 |
US8482132(B2) |
申请公布日期 |
2013.07.09 |
申请号 |
US20090575980 |
申请日期 |
2009.10.08 |
申请人 |
YANG CHIH-CHAO;HORAK DAVID V.;NOGAMI TAKESHI;PONOTH SHOM;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YANG CHIH-CHAO;HORAK DAVID V.;NOGAMI TAKESHI;PONOTH SHOM |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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