发明名称 |
Method of making semiconductor package with improved standoff |
摘要 |
A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices. |
申请公布号 |
US8481369(B2) |
申请公布日期 |
2013.07.09 |
申请号 |
US201113004028 |
申请日期 |
2011.01.11 |
申请人 |
LUO JUNHUA;PANG XINGSHOU;YAO JINZHONG;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
LUO JUNHUA;PANG XINGSHOU;YAO JINZHONG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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