| 摘要 |
One aspect of the present invention is a method of mounting a semiconductor chip having: a step of forming a resin coating 3 on a surface of a path connecting a bonding pad 2a on a surface of a semiconductor chip 2 and an electrode pad 1a formed on a surface of an insulating base material 1; a step of forming, by laser beam machining, a wiring gutter 4 having a depth that is equal to or greater than a thickness of the resin coating 3 along the path for connecting the bonding pad 2a and the electrode pad 1 a; a step of depositing a plating catalyst 5 on a surface of the wiring gutter 4; a step of removing the resin coating 3; and a step of forming an electroless plating coating 6 only at a site where the plating catalyst 5 remains. Another aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, wherein, on the surface of the three-dimensional structure, a recessed gutter for wiring is formed, extending between mutually intersecting adjacent faces of the three-dimensional structure, and wherein at least a part of a wiring conductor is embedded in the recessed gutter for wiring. |
