发明名称 POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
摘要 <p>PURPOSE: A power semiconductor device and a method for manufacturing the same are provided to increase the degree of integration of first and second electrodes by using a multilayer electrode pad for reducing the resistance between the first and second electrodes. CONSTITUTION: A second insulation layer (150) is divided to a third region and a fourth region. Third via electrodes are in contact with a first electrode pad. Fourth via electrodes are in contact with a second electrode pad. At least one third electrode pad is in contact with the third via electrodes. At least one fourth electrode pad (172) is in contact with the fourth via electrodes.</p>
申请公布号 KR20130077477(A) 申请公布日期 2013.07.09
申请号 KR20110146206 申请日期 2011.12.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, HEON BOK;KIM, KI SE
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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