| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a method for manufacturing the same are provided to increase the number of input/output terminals by electrically connecting a semiconductor chip to the outside by using the redistribution line of a redistribution pattern layer. CONSTITUTION: A first semiconductor chip (20) has a first size. A first conductive post (50) is located on a redistribution pattern layer. The first conductive post electrically connects the redistribution pattern layer to the first semiconductor chip. A second semiconductor chip (40) is located on the lower part of the first semiconductor chip. The second semiconductor chip has a second size smaller than the first size.</p> |
