CORRECTING METHOD OF OPTICAL INSPECTION AND SUBSTRATE FOR PACKAGE MANUFACTURED BY THE METHOD

摘要

PURPOSE: A correcting method of optical inspection and a substrate for package which is manufactured according to the same are provided to improve reliability by reducing a thickness deviation of a solder-resist. CONSTITUTION: A control unit determines whether an image error is detected from an optical image (S220). A correction design is set up in order to reduce a thickness deviation of a solder-resist (S230). A substrate is manufactured according to the determined correction design information (S240). A second optical inspection is performed about the substrate which is manufactured according to the correction design information (S250). The control unit determines whether an image error is detected in a corresponding area where an image error which is detected in a first optical inspection is generated or not (S260). [Reference numerals] (AA) Start; (BB,EE) No; (CC,DD) Yes; (FF) End; (S210) Perform a primary optical test on a substrate; (S220) An error of an optical image is detected?; (S230) Set up a correction design on the error-detected area; (S240) Prepare a substrate according to correction design information; (S250) Perform a secondary optical test on the prepared substrate; (S260) An error is detected in the optical error area?; (S270) Treat with a fine substrate