| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package for a surface-mount light-emitting device, which is composed of a white thermosetting composition that does not induce deterioration of a mold surface though continuously performing molding for a long period of time; and provide a surface-mount light-emitting device.SOLUTION: A resin molding for a surface-mount light-emitting device includes a recess for mounting an optical semiconductor element, in which at least a part of the recess is composed of a molding of a white thermosetting composition using a zinc oxide as a white pigment. The white thermosetting composition is such that, when it is heated, pressure molded, and subsequently hardened to obtain a resin hardened body, the resin hardened body has optical reflectance at 460 nm is 80%. In addition, the white thermosetting composition is available for more than 10000 times of consecutive molding without requiring mold recoating. Such a white thermosetting composition is used. |
