| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED die which produces less damage caused by peeling of a semiconductor layer though an LED device is subjected to solder reflow.SOLUTION: A semiconductor light-emitting element comprises an LED die 10 including a peeling member 15 between bump electrodes 16, 17. When the LED die 10 is flip-chip mounted on a circuit board 28 and covered with a fluorescent resin 21, the fluorescent resin 21 enters a gap formed on a mounting part by the bump electrodes 16, 17 and internal connection electrodes 22, 25 of the circuit board 28. Immediately after solder reflow, though the fluorescent resin 21 rapidly shrinks, the peeling member 15 peels off from the LED die 10 or the fluorescent resin 21. Accordingly, stress is not transferred from the fluorescent resin 21 to semiconductor layers of the LED die 10. |
