| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for manufacturing semiconductor device which can easily connect both of wires between a semiconductor element and lead parts, and wires between the semiconductor element and a semiconductor element mounting part with high reliability when manufacturing a semiconductor device.SOLUTION: A lead frame 1 for manufacturing semiconductor device comprises: a semiconductor element mounting part 2 where a semiconductor element is mounted on a top face; and a plurality of lead parts 3 provided around the semiconductor element mounting part 2 such that a tip of each lead part is opposed to the semiconductor element mounting part 2. The semiconductor element mounting part 2 includes: a first thick part 21; and a first thin part 22 notched at a circumference of the semiconductor element mounting part from an undersurface side, and having a thickness thinner than that of the first thick part 21 and electrically connected to the semiconductor element. Each lead part 3 includes a second thick part 31; and a second thin part 32 notched on the tip side from an undersurface side, and having a thickness thinner than that of the second thick part 31 and electrically connected to the semiconductor element. |
