| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board which can prevent immersion of moisture to a boundary between a base part of a via conductor and an insulation substrate; provide a semiconductor element mounting board in which a semiconductor element is mounted on the ceramic wiring board; and provide a semiconductor device housing the semiconductor element mounting board.SOLUTION: A ceramic wire board A comprises: a ceramic insulation substrate 1; salients 3 integrally formed on a surface 1A of the insulation substrate 1 and composed of the same material with the insulation substrate 1; and via conductors 5 each provided inside the insulation substrate 1 and the salient 3 and penetrating the insulation substrate 1 and the salient 3 in a thickness direction. With this configuration, the ceramic wiring board A, a semiconductor element mounting board B and a semiconductor device C, which have no insulation failure but have high thermal conductivity can be achieved. |
