| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a multilayer wiring board on which a failure such as disturbance of characteristic impedance at a boundary with a bent part is prevented.SOLUTION: The manufacturing method of the flex-rigid printed wiring board, which can be folded or twisted, comprises a process of laminating and solidifying a flex wiring base material, equipped with a plurality of two-layered microstrip line structures composed of a signal layer and ground layer formed under the signal layer, and a rigid base material whose central part is hollowed out. |
