发明名称 |
RESIN COMPOSITION, RESIN COMPOSITION SHEET AND METHOD OF MANUFACTURING RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL, B STAGE SHEET, RESIN COMPOSITION SHEET WITH SEMI-CURED METAL FOIL, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD, LED LIGHT SOURCE MEMBER, AND POWER SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE: A resin composition is provided to have excellent flexibility and ability to flow when molded to a sheet, and have excellent thermal conductivity and high insulating performance after the hardening of the resin composition. CONSTITUTION: A resin composition contains an epoxy resin having a biphenyl structure; an epoxy resin which is in a liquid state at room temperature; a phenol resin; and an inorganic filler which is alumina. The content of the inorganic filler is 75 wt% or more. The oil absorption amount of the total inorganic filler is 7.5 ml/100g or less. A resin composition sheet with an attached metal foil comprises a metal foil and a resin composition layer which is formed on the metal foil and formed of the resin composition.</p> |
申请公布号 |
KR20130076773(A) |
申请公布日期 |
2013.07.08 |
申请号 |
KR20120155409 |
申请日期 |
2012.12.27 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MIYAZAKI YASUO;GOTOH MASAKI;FUKUDA KAZUMASA;TANAKA HIROYUKI;AMANUMA SHINJI;TAKAHASHI HIROYUKI;HARA NAOKI;EZURE TOMOKI |
分类号 |
C08L63/00;B32B15/08;C08K3/22;C08L61/06 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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