METHOD OF MANUFACTURING PHOTONIC CRYSTAL BANDGAP DEVICE USING WET ETCHING PROCESS

摘要

PURPOSE: A method for manufacturing a photonic crystal band-gap element using a wet etching process is provided to utilize a chemical-mechanical polishing (CMP) process, thereby easily manufacturing the element. CONSTITUTION: A method for manufacturing a photonic crystal band-gap element using a wet etching process includes: a step (105) of bonding two wafers with a metal layer; a step (110) of implementing a chemical-mechanical polishing (CMP) process on the upper wafer, and adjusting the thickness of the upper wafer; a step (120) of forming a mask pattern using a photosensitive etching mask; and a step (125) of implementing a wet etching process on the mask pattern. [Reference numerals] (105) Wafer bonding; (110) Chemical-mechanical polishing; (115) Photonic crystal structure compensating circuit construction; (120) Pattern formation; (125) Preparation through a wet etch process; (AA) Start; (BB) End