发明名称 WIRING BOARD FOR MOUNTING LIGHT EMITTING ELEMENT, LIGHT-EMITTING MODULE, AND METHOD OF MANUFACTURING WIRING BOARD FOR MOUNTING LIGHT EMITTING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element, having less warpage and less warpage variation caused by heating and moisture absorption, capable of providing excellent light reflectivity, excellent in handling property and insulating resistance, and capable of mounting the light emitting element, and to provide a light-emitting module and a method of manufacturing the wiring board for mounting a light emitting element.SOLUTION: A wiring board for mounting a light emitting element 1 comprises: a metal pattern 2; a silicone layer 4 having opening parts 3A and 3B which enable mounting of an LED chip (light emitting element) by exposing the metal pattern 2, and containing an addition reaction type silicone which covers an upper face 2a, a lower face 2b, and an edge face of the metal pattern 2; and a resin film 6.
申请公布号 JP2013135069(A) 申请公布日期 2013.07.08
申请号 JP20110284109 申请日期 2011.12.26
申请人 HITACHI CABLE LTD 发明人 IMAI NOBORU;ISHIKAWA HIROSHI;TAGA KATSUTOSHI;ISAKA FUMIYA
分类号 H01L33/48 主分类号 H01L33/48
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