| 发明名称 |
COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED WAFERS |
| 摘要 |
A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step. |
| 申请公布号 |
KR20130076832(A) |
申请公布日期 |
2013.07.08 |
| 申请号 |
KR20127034156 |
申请日期 |
2011.06.03 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
YUN, HWANG KYU;LEON JEFFREY;PEDDI RAJ;KIM, YOUN SANG |
| 分类号 |
H01L21/301;H01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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