Audiobehandlingsanordning med indkapslet elektronisk komponent

摘要

The invention regards an audio processing device with at least one encapsulated electronic component mounted and electrically connected to electric leads in a mounting substrate. Further electric components are mounted for connection with the encapsulated electronic component through the substrate and the encapsulation material is moulded onto the substrate. According to the invention at least one metal layer is deposited on a surface part of the encapsulation material. The invention further regards a method for producing an amplifier for an audio device whereby at least one encapsulated electronic component is mounted on, and electrically connected to a PCB and where the encapsulation material is provided to protect the electronic component wherein further a metal layer is generated at least on a surface area of the encapsulation material.