| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer, which enables simple manufacturing of a semiconductor chip having a highly uniform thickness and excellent printing precision and which has excellent expandability.SOLUTION: A dicing sheet with a protective film forming layer comprises: a laminated sheet having a base film and a heat-resistant film; a protective film formation layer formed on an inner peripheral part of a surface of the heat-resistant film; and adhesive layers formed on outer peripheral parts of the surface of the heat-resistant film. The heat-resistant film has a melting point of above 130°C or has no melting point. The heat-resistant film has thermal shrinkage from -1% to +1% in heating at 130°C for two hours. |
