发明名称 MEMORY BANK ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a memory bank assembly which achieves excellent heat radiation effect.SOLUTION: A memory bank assembly of this invention includes: multiple insertion grooves provided on a printed circuit board; multiple memory banks inserted into the multiple insertion grooves; a support member fixing the printed circuit board; and at least one fan. The support member includes: a fitting plate provided with at least one vent hole; and multiple bearing parts extending vertically downward from four corners of the fitting plate and fixing the printed circuit board. When the fan is fixed to the fitting plate, the vent hole and the memory banks are placed facing each other.
申请公布号 JP2013135230(A) 申请公布日期 2013.07.08
申请号 JP20120276752 申请日期 2012.12.19
申请人 KOFUKIN SEIMITSU KOGYO (SHENZHEN) YUGENKOSHI;HON HAI PRECISION INDUSTRY CO LTD 发明人 HA WUI-MIN;WANG JUN HUI
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
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