| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of suppressing a warp of a laminated electronic component.SOLUTION: The laminated electronic component comprises: a laminate formed by alternately laminating a plurality of ceramic layers with a plurality of internal electrode layers; a cover layer laminated on the bottom surface of the laminate in a lamination direction of the laminate so as to cover the bottom surface; and a cover layer laminated on the top surface of the laminate in a lamination direction of the laminate so as to cover the top surface. A particle size of barium titanate powder constituting the cover layer laminated on the bottom surface is larger than a particle size of barium titanate powder constituting the laminate, and a particle size of the barium titanate powder constituting the cover layer laminated on the top surface is smaller than the particle size of the barium titanate powder constituting the laminate. |
