发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of reducing impact added to an electronic component during sucking and mounting the electronic component by a suction nozzle, with a simple structure and high responsivity.SOLUTION: An electronic component mounting device has servo motors 2a, 2b, and 2c for lifting/lowering suction nozzles 1a, 1b, and 1c; and a servo amplifier 3 for controlling the servo motors while receiving pulse signals from encoders 2d, 2e, and 2f of the servo motors. The electronic component mounting device sucks electronic components by the suction nozzles to mount them on a printed circuit board. The servo amplifiers set torque limit values when the suction nozzles are lowered, thereby controlling the servo motors; and decrease the torque limit values when a number of remaining pulses until a target position at which the suction nozzles contact with the electronic components or a target position at which the electronic components sucked by the suction nozzles contact with the printed circuit board becomes a predetermined number or less.
申请公布号 JP2013135049(A) 申请公布日期 2013.07.08
申请号 JP20110283585 申请日期 2011.12.26
申请人 SAMSUNG TECHWIN CO LTD 发明人 OGATA YUJI
分类号 H05K13/04 主分类号 H05K13/04
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