| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package for a surface mounting type light emitting device made of white color thermosetting composition which does not induce the deterioration of a mold surface even when performing long-term continuous molding, and to provide a surface mounting type light emitting device.SOLUTION: The resin molding for the surface mounting type light emitting device includes a recessed part for mounting an optical semiconductor element, wherein at least a part of the recessed part is made of the molding of the white color thermosetting composition using zinc oxide as a white color pigment, light reflectance at 460 nm of resin cured body provided by molding the white color thermosetting composition by heating pressurization and by performing the curing thereafter is 80% or more and such a white color thermosetting composition that the number of times of continuous molding during which the recoating of a mold is not required amounts to 10,000 or more is used. |
