发明名称 |
POWER DEVICES AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A power device and a method for manufacturing the same are provided to reduce leakage current by forming a regrowth GaN layer in a silicon carbide layer. CONSTITUTION: A silicon carbide layer (210) is formed on one surface of a substrate. A part of the silicon carbide layer is etched. A regrowth GaN layer is grown on an etched part. A first electrode (400) is formed on the silicon carbide layer. A second electrode (500) is formed on the other surface of the substrate.</p> |
申请公布号 |
KR20130076314(A) |
申请公布日期 |
2013.07.08 |
申请号 |
KR20110144859 |
申请日期 |
2011.12.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JAE HOON;KIM, KI SE |
分类号 |
H01L29/872;H01L29/737 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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