PROTECTIVE TAPE PEELING METHOD AND PROTECTIVE TAPE PEELING APPARATUS

摘要

PROBLEM TO BE SOLVED: To attach a peeling tape to a protective tape on a surface of a semiconductor wafer with high accuracy to peel off the protective tape.SOLUTION: A protective tape peeling method comprises: swinging a peeling bar 51 in accordance with an inclination in a width direction of a tape attachment surface for a peeling tape; attaching the peeling tape to a protective tape attached to a surface of a semiconductor wafer while keeping a front edge of the tape attachment surface and the peeling bar 51 parallel with each other; and peeling off the peeling tape by folding the peeling tape with the peeling bar 51. In association with this peeling operation of the peeling tape by the peeling bar 51, the protective tape is peeled off from the surface of the semiconductor wafer together with the peeling tape, and the peeling tape is rewound by a winding shaft of a tape collection part together with the protective tape.