| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a particle capturing plate capable of effectively suppressing peeling of a deposited film.SOLUTION: The film deposition apparatus 1 has the particle capturing plate 30 disposed in a vacuum vessel 3. A first unevenness 32, and a second unevenness 34 provided on the first unevenness 32 and finer than the first unevenness 32 are formed on a surface 30a of the particle capturing plate 30. Thus, peeling of a deposited film can be effectively suppressed. |
