发明名称 MULTILAYER SHEET, CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer sheet which prevents the generation of burrs and an effect of the generation of the burrs depending on punching conditions.SOLUTION: The multilayer sheet includes a base material layer and a conductive layer. A tensile elastic modulus of the multilayer sheet is 1,400-2,200 MPa, and penetration energy per thickness by a surface impact of the multilayer sheet is 1.7-3.0 J/mm. The carrier tape for packaging the electronic component is constituted of the multilayer sheet.
申请公布号 JP2013132864(A) 申请公布日期 2013.07.08
申请号 JP20110285719 申请日期 2011.12.27
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJIMOTO TAKAHIRO;WATANABE MASAHIKO
分类号 B32B27/30;B65D73/02;B65D85/86 主分类号 B32B27/30
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