发明名称 |
MULTILAYER SHEET, CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENT USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer sheet which prevents the generation of burrs and an effect of the generation of the burrs depending on punching conditions.SOLUTION: The multilayer sheet includes a base material layer and a conductive layer. A tensile elastic modulus of the multilayer sheet is 1,400-2,200 MPa, and penetration energy per thickness by a surface impact of the multilayer sheet is 1.7-3.0 J/mm. The carrier tape for packaging the electronic component is constituted of the multilayer sheet. |
申请公布号 |
JP2013132864(A) |
申请公布日期 |
2013.07.08 |
申请号 |
JP20110285719 |
申请日期 |
2011.12.27 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
FUJIMOTO TAKAHIRO;WATANABE MASAHIKO |
分类号 |
B32B27/30;B65D73/02;B65D85/86 |
主分类号 |
B32B27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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