发明名称 CURABLE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured product having high heat resistance and high light resistance, capable of maintaining an advantageous dispersion state of inorganic fine particles even when the composition is heated, and having a low viscosity and advantageous workability.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound, core-shell-type acrylic polymer particles having a solubility parameter (by the Fedors method) of 19.5 to 21.5 [MPa], and inorganic fine particles having an average particle diameter of 30 μm or less and a specific gravity of 10 g/cmor less, wherein the glass transition temperature of an acrylic polymer constituting a core of the core-shell-type acrylic polymer particle is 60 to 120°C; the glass transition temperature of an acrylic polymer constituting a shell of the core-shell-type acrylic polymer particle is 60 to 120°C; and the content of the core-shell-type acrylic polymer particle is 1 to 30 pts.wt. based on 100 pts.wt. of the alicyclic epoxy compound.
申请公布号 JP2013133465(A) 申请公布日期 2013.07.08
申请号 JP20110286904 申请日期 2011.12.27
申请人 DAICEL CORP 发明人 TAKENAKA HIROTAKA;TAKEMOTO SHIN
分类号 C08L63/00;C08G59/24;C08G59/38;C08K3/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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