发明名称 POWER SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power semiconductor device which achieves higher productivity compared to conventional power semiconductor devices and ensures operation reliability over a long time period.SOLUTION: A power semiconductor device includes: an insulation substrate 1 where a power semiconductor element 3 is mounted; a printed circuit board 7 that is disposed facing the insulation substrate and has wiring on both surfaces; a resin housing 9 holding the insulation substrate and the printed circuit board; and an external terminal 8 connected with a circuit of the printed circuit board 7. The power semiconductor device further includes a flexible terminal 6 which electrically connects the power semiconductor element with a circuit of the printed circuit board and has flexibility.
申请公布号 JP2013135105(A) 申请公布日期 2013.07.08
申请号 JP20110284875 申请日期 2011.12.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUDO SHINGO;ASADA SHINSUKE;FUJINO JUNJI;TOKUMARU JUN;KAJIWARA TAKANOBU
分类号 H01L25/07;H01L25/18;H02M7/48 主分类号 H01L25/07
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