发明名称 |
POWER SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device which achieves higher productivity compared to conventional power semiconductor devices and ensures operation reliability over a long time period.SOLUTION: A power semiconductor device includes: an insulation substrate 1 where a power semiconductor element 3 is mounted; a printed circuit board 7 that is disposed facing the insulation substrate and has wiring on both surfaces; a resin housing 9 holding the insulation substrate and the printed circuit board; and an external terminal 8 connected with a circuit of the printed circuit board 7. The power semiconductor device further includes a flexible terminal 6 which electrically connects the power semiconductor element with a circuit of the printed circuit board and has flexibility. |
申请公布号 |
JP2013135105(A) |
申请公布日期 |
2013.07.08 |
申请号 |
JP20110284875 |
申请日期 |
2011.12.27 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SUDO SHINGO;ASADA SHINSUKE;FUJINO JUNJI;TOKUMARU JUN;KAJIWARA TAKANOBU |
分类号 |
H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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