| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board which is high in reliability and excellent in via connection stability.SOLUTION: A method of manufacturing a circuit board can be provided in which, by forming a mask film on a surface layer of a plastic film layer that is a feature of the mask film by mixing a thermosetting resin and thermoplastic resin having no melting point, the mask film is brought into a dissolved state and degenerated by surface tension, a cross section becomes thicker than a normal part, a projecting part is formed, and the filling amount of conductive paste can be increased. Consequently, via connection stability is high. |
