摘要 |
PROBLEM TO BE SOLVED: To provide an LED reliability evaluation method in which electromigration-related evaluation is suitably carried out without requiring time and effort.SOLUTION: The evaluation method comprises the steps of: forming a p-type electrode and an n-type electrode as well as a p-side branch electrode and an n-side branch electrode in the main region of an insulating substrate; forming a pad part 41, a pad part 42 and a wiring part 46 made from the same material as the p-side and the n-side branch electrodes in a TEG region; obtaining an LED chip and an evaluation chip 51 from the main region and the TEG region, respectively; and carrying out evaluation of the LED with regard to electromigration by using the evaluation chip 51. The step in which evaluation is carried out includes a step of conducting electricity to the pad part 41, the pad part 42 and the wiring part 46 by an electromigration evaluation device, and also automatically measuring a change in characteristics of the evaluation chip 51 under a high temperature condition periodically. |