发明名称 PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF PATTERNED CURED FILM, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing generation of a residue during development, that is, excellent in developing property, and showing good contrast, and to provide a manufacturing method of a patterned cured film using the photosensitive resin composition, and an electronic component having the patterned cured film.SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates acid with light, (C) a thermal crosslinking agent, and (D) a phenolic low molecular compound.
申请公布号 JP2013134346(A) 申请公布日期 2013.07.08
申请号 JP20110283982 申请日期 2011.12.26
申请人 HITACHI CHEMICAL CO LTD 发明人 TAHARA SHINGO;NOBE SHIGERU;KASUYA KEI;MATSUTANI HIROSHI;AOKI MASARU;UENO TAKUMI;KATOGI SHIGEKI;TANIMOTO AKITOSHI
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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