| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily ensure an insulation distance between electrode terminals when a lead frame is used, which can be manufactured at low cost and achieve downsizing, and which has excellent reliability.SOLUTION: A semiconductor device comprises: a lead frame 1 to which a semiconductor element 2 is connected; electrode terminals 4 connected to the lead frame 1; a first encapsulation resin 8 encapsulating the semiconductor element 2, the electrode terminals 4 and the lead frame 1 so as to expose a part of each electrode terminal 4; and a second encapsulation resin 9 encapsulating the lead frame 1 exposed from the first encapsulation resin 8. |
