发明名称 Polyamide resin composition having improved surface reflectance and heat resistance
摘要 A polyamide resin composition includes (A) a polyamide resin in an amount of about 30 to about 80% by weight, (B) inorganic filler in an amount of about 10 to about 60% by weight, (C) white pigment in an amount of about 5 to about 50% by weight; and (D) photostabilizer in an amount of about 0.05 to about 2 parts by weight and (E) inorganic fine particles in an amount of about 0.05 to about 3 parts by weight, wherein each of (D) and (E) is based on about 100 parts by weight of the polyamide resin (A). The polyamide resin composition can have good light reflectance and yellowing resistance.
申请公布号 KR101282706(B1) 申请公布日期 2013.07.05
申请号 KR20100093676 申请日期 2010.09.28
申请人 发明人
分类号 C08K3/00;C08K5/17;C08K7/14;C08L77/00 主分类号 C08K3/00
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