| 摘要 |
PURPOSE: An epoxy resin composition is provided to provide excellent cured material with excellent transparency, heat resistance, strength, flatness, and light stability. CONSTITUTION: An epoxy resin composition for transparent circuit board comprises an epoxy resin which has a polycyclic carbonic acid represented by chemical formula 1 or 2, and a fatty cyclic structure in the molecule. In chemical formula 1, R^1 is hydrogen, a C1-6 alkyl group, or a carboxy group; R^2 is hydrogen or a methyl group; P is a functional group represented by chemical formula 1-a, 1-b, and/or 1-c; and * is bonded with a methylene group. In chemical formula 2, R^1 and * are the same as that of chemical formula 1; R^3 is hydrogen or a C1-15 hydrocarbon group; and P is a functional group represented by chemical formula 1-d.
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