| 摘要 |
PURPOSE: A molding device for manufacturing a semiconductor package is provided to easily control the thickness of a cavity by including a lifting block to control the height of a space for forming the cavity. CONSTITUTION: A first mold (10) includes a receiving space in which a semi-processed package is fixed. A second mold (20) includes a space for forming a cavity (25). A lifting base (11) is installed in the receiving space of the first mold to vertically move. A lifting unit (30) supports the lifting base to vertically move. The lifting unit includes a gauge block (31), a first lifting block (32), and a second lifting block (33).
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