发明名称 HEAT RADIATION SUBSTRATE AND METHOD FOR MANUFACTURING THIN FILM THEREOF
摘要 PURPOSE: A heat radiation substrate and a method for manufacturing a thin film are provided to improve the deposition speed and density of the thin film by forming the thin film after filler powder and ceramic powder are changed into aerosols and are deposited on a substrate. CONSTITUTION: Material powder is generated by mixing ceramic powder with filler powder. The ceramic powder and the filler powder are changed into aerosols and a thin film (120) is formed by spraying the aerosols on a substrate (110). The substrate with the thin film is heated at temperatures between the melting point of the ceramic powder and the melting point of glass powder. A circuit pattern (130) made of copper or gold is formed on the upper side of the thin film. The filler powder includes epoxy or polyimide based polymer materials or the glass powder.
申请公布号 KR20130075553(A) 申请公布日期 2013.07.05
申请号 KR20110143952 申请日期 2011.12.27
申请人 KOREA ELECTRONICS TECHNOLOGY INSTITUTE 发明人 CHO, HYUN MIN;KIM, MIN SUN
分类号 H01L23/36 主分类号 H01L23/36
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