发明名称 |
METHOD FOR RESIN MOLDING AND RESIN MOLDING APPARATUS |
摘要 |
<p>PURPOSE: A method and an apparatus for molding resin are provided to easily remove a molded product by accurately positioning a work on a clamping surface. CONSTITUTION: A work (W) is adsorbed onto the clamping surface of a lower die (2). A lower die is formed in a molding die set. A common recess part (4) is formed in the clamping surface of an upper die (3). The upper die is fixed to a fixing platen. The parallelism between the upper die and the lower die is adjusted.</p> |
申请公布号 |
KR20130075699(A) |
申请公布日期 |
2013.07.05 |
申请号 |
KR20120153287 |
申请日期 |
2012.12.26 |
申请人 |
APIC YAMADA CORPORATION |
发明人 |
TAGAMI SHUSAKU;MURAMATSU YOSHIKAZU;MAEKAWA MASANORI;NAKAZAWA HIDEAKI;FUJISAWA MASAHIKO;MIYAMOTO TAKUYA |
分类号 |
H01L21/56;B29C43/18;B29C43/32;B29C43/36 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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