发明名称 METHOD FOR RESIN MOLDING AND RESIN MOLDING APPARATUS
摘要 <p>PURPOSE: A method and an apparatus for molding resin are provided to easily remove a molded product by accurately positioning a work on a clamping surface. CONSTITUTION: A work (W) is adsorbed onto the clamping surface of a lower die (2). A lower die is formed in a molding die set. A common recess part (4) is formed in the clamping surface of an upper die (3). The upper die is fixed to a fixing platen. The parallelism between the upper die and the lower die is adjusted.</p>
申请公布号 KR20130075699(A) 申请公布日期 2013.07.05
申请号 KR20120153287 申请日期 2012.12.26
申请人 APIC YAMADA CORPORATION 发明人 TAGAMI SHUSAKU;MURAMATSU YOSHIKAZU;MAEKAWA MASANORI;NAKAZAWA HIDEAKI;FUJISAWA MASAHIKO;MIYAMOTO TAKUYA
分类号 H01L21/56;B29C43/18;B29C43/32;B29C43/36 主分类号 H01L21/56
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